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August 2004

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Subject:
From:
Louis Hart <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Louis Hart <[log in to unmask]>
Date:
Tue, 31 Aug 2004 10:47:57 -0400
Content-Type:
text/plain
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text/plain (76 lines)
Technetters, in the future please provide personal replies offline.  Thank
you.  Louis Hart

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Marvin Gaines
Sent: Monday, August 30, 2004 11:53 PM
To: [log in to unmask]
Subject: Re: [TN] Thermal cyclying and burn-in spec.


Thanks

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Monday, August 30, 2004 11:27 PM
To: [log in to unmask]
Subject: Re: [TN] Thermal cyclying and burn-in spec.


Hi Ted,
There is no--and cannot be, a spec on burn-in.   Burn-in needs to be
specific
to the product involved, as well as to the products maturity.
Thermal cycling depends on its purpose--accelerated reliability testing of
prototypes or environmental stress screening (ESS) of product.
You should look at IPC-SM-785 to get info for all the above; if you need
more
contact me.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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