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August 2004

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Subject:
Re: tented Via
From:
Franklin D Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Franklin D Asbell <[log in to unmask]>
Date:
Mon, 30 Aug 2004 13:18:24 -0500
Content-Type:
text/plain
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text/plain (21 lines) 
It might, but I would wager it appears as though there were a fine layer of
mask stretching across the via hole, that snapped back producing an
opening...viewed from the top it would probably have the appearance of well
reduced via hole size, from the opposite side of the board (on those where
not solder is present) it probably looks like flash nearly covering the pad
requiring tenting...

But a picture does say a thousand words...

Franklin

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