Yes, I am aware of the 'IPC definition' for tenting...in the real world
beyond the boundries of IPC definitions, tenting can be 'broken' (evidenced
by pinholes, voids, etc all allowable by specification) thus leaving access
for solder to enter hole and not violate any IPC criteria...

Tenting is not a good method when a customer or assembler is attempting to
do what the gentleman desired to do...plugging is a better choice...

Franklin



----- Original Message -----
From: "James Hofer" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, August 30, 2004 12:09 PM
Subject: Re: [TN] tented Via


> Tenting covers the top of the via pad and the hole. It "tents" the hole.
> Please refer to IPC definitions for further clarification.
>
> James Hofer
> Director of Operations
> Accurate Circuit Engineering
> 3019 S. Kilson Dr.
> Santa Ana Ca. 92707-4202
> 714-546-2162 work
> 714-473-6127 cell
> [log in to unmask]
> ----- Original Message -----
> From: "Franklin D Asbell" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Monday, August 30, 2004 10:05 AM
> Subject: Re: [TN] tented Via
>
>
> > If there is nothing for the solder to wet to (absence of metal???) in
the
> > via how will current flow through the via???
> >
> > I would say plug the vias instead of tenting them. With tenting you are
> > applying solder mask solely to the pad surface, not the via hole wall,
> this
> > allows for an opening from the top of the board into the via hole that
is
> > easily filled with solder, solder that can rob needed solder from the
> leads,
> > or worse, ball up and redeposit itself in unwanted places such as
between
> > non-common leads...a short.
> >
> > Plug the vias from the top side, provide the fabricator with a plugged
via
> > gerber file detailing those vias to be plugged, specify this is a
separate
> > process from solder mask coating. The process is pretty simple, using
the
> > plug artwork the vias are filled with solder and cured, then the regular
> > artwork is used with vias tented.
> >
> > This will ensure solder will not enter the vias thus robbing the leads
and
> > will also prevent solder shorted leads...
> >
> > Franklin
> >
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