Tenting covers the top of the via pad and the hole. It "tents" the hole.
Please refer to IPC definitions for further clarification.

James Hofer
Director of Operations
Accurate Circuit Engineering
3019 S. Kilson Dr.
Santa Ana Ca. 92707-4202
714-546-2162 work
714-473-6127 cell
[log in to unmask]
----- Original Message -----
From: "Franklin D Asbell" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, August 30, 2004 10:05 AM
Subject: Re: [TN] tented Via


> If there is nothing for the solder to wet to (absence of metal???) in the
> via how will current flow through the via???
>
> I would say plug the vias instead of tenting them. With tenting you are
> applying solder mask solely to the pad surface, not the via hole wall,
this
> allows for an opening from the top of the board into the via hole that is
> easily filled with solder, solder that can rob needed solder from the
leads,
> or worse, ball up and redeposit itself in unwanted places such as between
> non-common leads...a short.
>
> Plug the vias from the top side, provide the fabricator with a plugged via
> gerber file detailing those vias to be plugged, specify this is a separate
> process from solder mask coating. The process is pretty simple, using the
> plug artwork the vias are filled with solder and cured, then the regular
> artwork is used with vias tented.
>
> This will ensure solder will not enter the vias thus robbing the leads and
> will also prevent solder shorted leads...
>
> Franklin
>
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