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| Date: | Sat, 28 Aug 2004 09:28:00 +0530 |
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CHECKLIST FOR PCB
1. Customer :
2. Order ref :
3. PCB Code : Issue Level:
4. PCB Class : 1/2/3/4
5. Laminate 6. Base Copper 7. Solder Mask
8. Sol.Mask Colour
( ) FR2 ( ) One Side ( ) One Side
( ) Green
( ) CEM1 ( ) Two Sides ( ) Two Sides
( ) Blue
( ) FR4 ( ) 17.5 microns ( ) Both sides file
( ) ..............
( ) Other.......... ( ) 35.0 microns ( ) Both sides different
film
.................... ( ) 70.0 microns ( ) Two Component Epoxy
( ) ..................... ( ) Liquid
Photoimageable
( ) Dry Film
( ) Via Holes
Filled
( ) Via Hole
Pads covered one side
( ) Via Hole
Pads covered both sides
9. Legend Printing (Silk Screen Component Notation) Colour
( ) Component Side (
) White ( ) Black
( ) Solder Side
( ) Yellow ( ) ..............
10. Copper Plating
· Plated through hole Cu thickness
............microns (Tolerance +/- .......)
· Finished Cu thickness on surface including base Cu ............microns
(Tolerance +/-........)
· Consent for modifying pattern design without effecting
circuit connectivity inorder to achieve uniformity in plating ( )
Granted
isolated tracks and pads
( ) Not Granted
11. Protective Finish
( ) Solder Mask On Bare Copper (SMOBC)- Hot Air Levelled Sn/Pb
( ) Solder Mask on Fused Tin and Lead track and pads
( ) Solderable Lacquer (Flux)
( ) Organic Surface Protectant (OSP)
( ) Gold and Nickel on Pads Minimum Gold Thickness
..........microns
Minimum Nickel Thickness ..........microns
( ) Gold and Nickel on tabs (fingers) Minimum Gold Thickness
..........microns
Minimum Nickel
Thickness .......... microns
Minimum thickness of Solder Coating (Sn/Pb)
..................microns
12. MARKINGS (a) ( ) Manufacturer (b) ( ) UL
(c) ( ) Customer
Logo & Date Marking Logo or Name
1 Copper Pattern Solder Side ( )
( ) ( )
2 Copper Pattern Component Side ( ) ( ) ( )
3 Solder Masking on Solder Side ( ) ( ) (
)
4 Solder Masking on Component Side ( ) ( )
( )
5 Legend Printing ( )
( ) ( )
13. Special Features/Processes
( ) Black Oxide Coating ( ) Carbon Printing ( ) Peelable Mask
14. Art Work Requirements
Gereber Files Films Gerber Files Films
1 Copper Top Side ( ) ( ) 6.SilkScreenTopSide ( ) ( )
2 Copper Bottom Side ( ) ( ) 7.Profiling ( ) ( )
3 Solder Resist Top Side ( ) ( ) 8.V-Groove ( ) ( )
4 Solder Resist Bottom Side ( ) ( ) 9. Carbon Printing ( ) ( )
5. Silk Screen Bottom Side ( ) ( ) 10.Peelable Mask ( ) ( )
15. Drilling Files
EXCELLON ( ) SIEB & MYER ( )
VERSION ( ) 4000 to 4010 ( ) 5000 to 5010 ( ) 1000 to 1010 ( ) 3000 to 3010
16. Routing Files
EXCELLON ( ) SIEB & MYER ( )
VERSION ( ) 4000 TO 4010 ( ) 5000 TO 5010 ( ) 1000 to 1010 ( ) 3000 to 3010
17. Specified Distances from the Reference Point
( ) HOLE ( ) OPTICAL TARGETS
( ) SLOTS ( ) CHAMFERING
( ) PROFILING EDGE ( ) COUNTER SINK
18. TOLERANCES
(a) PLATED HOLES ............+/- mm
(b) NON PLATED HOLES ............+/- mm
(c) GENERAL TOLERANCES FOR PROFILING .............+/-mm
(d) TRACK WIDTH REDUCTION .............+/-mm
(e) MINIMUM TRACK WIDTH ..............+/-mm
(f) MINIMUM ANNULAR RING ..............+/-mm
(g) MINIMUM AIR GAP ..............+/-mm
(h) SCORING DEPTH ..............+/-mm
19. PANELIZATION
(a) SINGLE BOARD SIZE ................mm x ........... .mm (length x width)
(b) PANEL SIZE- nos of (a) per panel ..................nos. In ONE
(c) WEB AROUND THE PANEL ( )
(d) MOUNTING HOLES LOCATION IN THE WEB ( )
(e) MINIMUM DISTANCE BETWEEN CONSECUTIVE SCORING LINES ..............mm
(f) NUMBER OF ‘V’ GROOVES ..............
(g) ANY JUMP SCORING YES/NO
(h) SCORING DEPTH ...............mm
(I) Can multiple panels with some crossed out individual PCB rejects be
supplied YES/NO
(j) If yes, then maximum numbers of such marked rejects per panel
permitted ...............nos
(k) Should such panels with a few rejected boards be marked and packed
separately YES/NO
20. ELECTRICAL TESTING
(a) Minimum SMD Pitch ........... mm
21. ASSEMBLY PROCESS
(a) AUTOMATIC INSERTION ( )
(b) CNC PICK & PLACE ( )
(c) MANUAL ( )
(d) TYPE & MAKE OF FLUX BEING
USED...............................................................................................................
..................................(enclose FLUX data sheets if possible)
(e) PRE HEATING TEMP. & DURATION BEFORE ASSEMBLY .................
(f) WAVE TEMPERATURE AND CONTACT DURATION IN WAVE
SOLDERING. .....................................
(g) IS THE ASSEMBLY BEING DONE IN HOUSE YES/NO
(f) IF NO - SPECIFY PROCESS DETAILS AT EACH OF THE CONTRACT ASSEMBLERS.
22. QUALITY NORMS
1. IPC SPECIFICATIONS ( )
2. IEC SPECIFICATIONS ( )
3. BS SPECIFICATIONS ( )
4. PERFAG ( )
5. ANY OTHER ( ) Please Specify
23. PACKING INSTRUCTIONS
1. BOARDS TO BE WRAPPED IN BUTTER PAPER ( )
2. BOARDS TO BE WRAPPED IN PE FOIL ( )
3. NUMBER OF BOARDS IN EACH WRAPPING/PACK ............
4. PACKING SLIP TO CONTAIN
a) MANUFACTURER ( )
b) PCB TYPE & REVISION ( )
c) QUANTITY PACKED ( )
5.MAXIMUM WEIGHT PERMITTED PER CARTON ........................(Please
specify)
Name of the person filling the check list
..............................................................................
Designation
..............................................................................
Date
...............................................................................
SIGNATURE
...............................................................................
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