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August 2004

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Subject:
From:
Jim Henderson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jim Henderson <[log in to unmask]>
Date:
Fri, 27 Aug 2004 15:22:11 -0400
Content-Type:
text/plain
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text/plain (55 lines)
Cal,

I know quite a bit of board houses, including us, use spray coaters for
applying our LPI.  The finished thickness of that is .0008 to .001.  So
there is very little chance that will plug your via hole.  We have to plug
via holes as a separate screen printing process. If to plug or tent the vias
is called out on your drawing this is how we would do it.  Good luck.

Jim

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Cal Driscoll
Sent: Friday, August 27, 2004 1:15 PM
To: [log in to unmask]
Subject: [TN] tented Via


Hello All-

I am not a board fab person but would like to understand why some LPI
masking processes can not tent vias (non filled).

We have a board house that can tent vias with no issues. When we went to
another board house the are unable to tent vias. Both shops are huge and
have international locations. I would think the technology would be there to
do this.

thanks in advance,
Cal
www.ctdi.com

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