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August 2004

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Subject:
From:
"Whittaker, Dewey (AZ75)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (AZ75)
Date:
Fri, 27 Aug 2004 11:58:37 -0700
Content-Type:
text/plain
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text/plain (50 lines)
It takes intents effort to do it right. Dependent on size a dry film cap
followed by a LPI cover has been one method to achieve satisfactory results
in a high-rel environment.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Cal Driscoll
Sent: Friday, August 27, 2004 10:15 AM
To: [log in to unmask]
Subject: [TN] tented Via


Hello All-

I am not a board fab person but would like to understand why some LPI
masking processes can not tent vias (non filled).

We have a board house that can tent vias with no issues. When we went to
another board house the are unable to tent vias. Both shops are huge and
have international locations. I would think the technology would be there to
do this.

thanks in advance,
Cal
www.ctdi.com

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