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Date: | Fri, 27 Aug 2004 11:58:37 -0700 |
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It takes intents effort to do it right. Dependent on size a dry film cap
followed by a LPI cover has been one method to achieve satisfactory results
in a high-rel environment.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Cal Driscoll
Sent: Friday, August 27, 2004 10:15 AM
To: [log in to unmask]
Subject: [TN] tented Via
Hello All-
I am not a board fab person but would like to understand why some LPI
masking processes can not tent vias (non filled).
We have a board house that can tent vias with no issues. When we went to
another board house the are unable to tent vias. Both shops are huge and
have international locations. I would think the technology would be there to
do this.
thanks in advance,
Cal
www.ctdi.com
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