Ahhhh Beautiful Reply Dave...

just what I needed to here.
Thanks sooo much

-----Original Message-----
From: Dave Seymour [mailto:[log in to unmask]]
Sent: Friday, August 27, 2004 2:52 PM
To: TechNet E-Mail Forum; Cal Driscoll
Subject: Re: [TN] tented Via


All boards houses can pour soldermask in a hole and it will looked
tented.

Some board houses will sell you fabs this way. Others will tell you that
this is a bad practice and won't do it. This is because they can't
guarantee that the mask
will cure in the hole and it may out gas later during the assembly
process. This then
opens up the hole to collect contaminates. Latent field failures.

Bring the mask up to the edge of the via hole, enlarged by 3-6 mils.
Or
Fill the via with a via filler material and mask over.

Hope this helps
dave


Cal Driscoll wrote:

>Hello All-
>
>I am not a board fab person but would like to understand why some LPI
>masking processes can not tent vias (non filled).
>
>We have a board house that can tent vias with no issues. When we went to
>another board house the are unable to tent vias. Both shops are huge and
>have international locations. I would think the technology would be there
to
>do this.
>
>thanks in advance,
>Cal
>www.ctdi.com
>
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--
Dave Seymour, CID+
Catapult Communications Inc.
800 Perimeter Park Dr, Suite A
Morrisville, NC 27560

Direct: (919)653-4249
Main: (919)653-4180
Fax: (919)653-4297

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