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August 2004

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Subject:
From:
"Wolfgang E. Erat" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wolfgang E. Erat
Date:
Fri, 27 Aug 2004 14:22:51 -0400
Content-Type:
text/plain
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text/plain (58 lines)
Hi

For a start, you may want to verify what each house says they can do versus
what they actually have done on a volume basis. Unfortunately there is no
other way than to look at a number of boards under a microscope, or, if you
can afford it to place a proto order. Sales people have been known to sell
stuff they do not really have to sell.

good luck

----- Original Message -----
From: "Cal Driscoll" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, August 27, 2004 1:14 PM
Subject: [TN] tented Via


> Hello All-
>
> I am not a board fab person but would like to understand why some LPI
> masking processes can not tent vias (non filled).
>
> We have a board house that can tent vias with no issues. When we went to
> another board house the are unable to tent vias. Both shops are huge and
> have international locations. I would think the technology would be there
to
> do this.
>
> thanks in advance,
> Cal
> www.ctdi.com
>
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