Embedded Passive Components-From Design to Future Trends 

IPC- Association Connecting Electronics Industries and the FED, Fachverband Elektronik Design e.V., are hosting a FREE one-hour Webinar on Wednesday, 22 September, 2004, at 15:00, Berlin time or 13:00 GMT. (9:00 am Eastern Standard Time, U.S.A.) 

This event will consist of a 45 minute web presentation that will highlight three technical papers on embedded passives. You'll get a sneak peek of the IPC/FED's Embedded Passive Components Conference in November in Munich.
 
This Webinar will be based on three paper presentations originally developed by Martin Novotny, FUBA Printed Circuits GMBH of Gittelde, Germany, Kimmo Perälä, of Aspocomp Group, Finland and Greg Schroeder of Sanmina-SCI. Get great information without leaving your own office!

This session will be segmented into three papers: 

* A General Overview on Embedded Components and Future Trends 
        Martin Novotny, FUBA Printed Circuits GMBH 

* Embedded Resistors in HDI Printed Circuits Boards 
        Kimmo Perala, Aspocomp Group 

* Advantages of Thin Laminate Buried Capacitance Constructions for High Speed PCB Applications 
        Greg Schroeder, Sanmina-SCI 

Find out about what types of materials are currently available and what is needed for future requirements. The driving force behind embedded passives is the major cost savings, but an understanding of the customer application and board reliability is critical to success. This session will cover thin and thick film technologies, capacitors and stack up material. 

The second segment will cover the resistors in HDI printed circuit boards, how they are designed and fabricated and how to improve the high frequency performance of the HDI circuit. The third segment will address the use of buried capacitors, particularly for high speed applications.

Register now for this one hour event by going to http://www.ipc.org/calendar/EmbPaswebcast_92204/EmbPaswebcast_92204.htm. And, it's all for the price of a phone call! 

P.S. You can't learn everything in one hour, but you can learn a lot. IPC and FED are also hosting the International Conference on Embedded Passive Components, 8-9 November in Munich, Germany. Go to http://www.ipc.org/EPGermany for more information and to register now! 

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