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August 2004

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Subject:
From:
Ken Patel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ken Patel <[log in to unmask]>
Date:
Thu, 26 Aug 2004 16:19:22 -0700
Content-Type:
text/plain
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text/plain (110 lines)
No. Who can run it? Can I ask my fab house or assembly house to run it?

Re,
Ken Patel

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, August 26, 2004 4:17 PM
To: [log in to unmask]; [log in to unmask]
Cc: [log in to unmask]
Subject: Re: [TN] Solderability Issue on ENIG board

Hi Ken! Have you run a JSTD-003A solderability test on the suspect pwbs
yet?

Dave Hillman
Rockwell Collins
[log in to unmask]




                      Ken Patel

                      <[log in to unmask]        To:       [log in to unmask]

                      OM>                      cc:

                      Sent by: TechNet         Subject:  [TN] Solderability
Issue on ENIG board
                      <[log in to unmask]>





                      08/26/2004 02:40

                      PM

                      Please respond to

                      TechNet E-Mail

                      Forum; Please

                      respond to Ken

                      Patel









All,
I am finding non-wetting at the certain locations on the boards (four
places
to be exact) where solder is creating golden islands (bec' of ENIG) which
you can see in the picture. In the picture, you can see that toe of pads
does not allow any wetting of the solder.

I would like to get an expert opinion on the subject as why certain
locations have problems and what are the possible reasons for non-wetting.
I
very much doubt this as an assembly problem as peak temp was around 218c
and
solder remains liquidous for more than 45 seconds.



Picture can be found at...Thanks to Daan.

http://www.smtinfo.net/forum/index.php?showtopic=54
<http://www.smtinfo.net/forum/index.php?showtopic=54>



Re,

Ken Patel


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