I would not strip solder and re-level as any solder stripper would also
attack the copper. Our experience with stripping reflowed tin/lead has in
many cases reduced hole wall copper thickness below acceptable requirements.
Running the parts thru HAL once more is usually an acceptable rework for
this issue although I do not believe this is addressed in IPC specs.


James Hofer
Director of Operations
Accurate Circuit Engineering
3019 S. Kilson Dr.
Santa Ana Ca. 92707-4202
714-546-2162 work
714-473-6127 cell
[log in to unmask]
----- Original Message -----
From: "Eddie Rocha" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, August 25, 2004 9:06 AM
Subject: Re: [TN] Low solder rework


> Rework is due to solder thknss. I've re-HASL'd before with success but
with
> prototype orders. One of my concerns is: does IPC have a position on this
> type of rework?
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Tom Gervascio
> Sent: Wednesday, August 25, 2004 5:22 AM
> To: [log in to unmask]
> Subject: Re: [TN] Low solder rework
>
>
> The question would be why are they being reworked? Is it solderability or
> solder thickness related?
>
> Re-HASL might grow a thicker layer of copper tin intermetallic. I would
> think removing the solder chemically, re cleaning and HASL would be
> desirable.
>
> My two cents worth
>
> >>> [log in to unmask] 08/24/04 06:14PM >>>
> Is there a rework spec or standard for bare PCB's with low solder? Would
it
> be acceptable to simply re-HASL (hot-air-solder-level)them? Any
reliablility
> issues with re-HASL? These are class 3 type bds.
> Thanks in advance for your help.
>
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Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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