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Date: | Wed, 25 Aug 2004 09:06:47 -0700 |
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Rework is due to solder thknss. I've re-HASL'd before with success but with
prototype orders. One of my concerns is: does IPC have a position on this
type of rework?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Tom Gervascio
Sent: Wednesday, August 25, 2004 5:22 AM
To: [log in to unmask]
Subject: Re: [TN] Low solder rework
The question would be why are they being reworked? Is it solderability or
solder thickness related?
Re-HASL might grow a thicker layer of copper tin intermetallic. I would
think removing the solder chemically, re cleaning and HASL would be
desirable.
My two cents worth
>>> [log in to unmask] 08/24/04 06:14PM >>>
Is there a rework spec or standard for bare PCB's with low solder? Would it
be acceptable to simply re-HASL (hot-air-solder-level)them? Any reliablility
issues with re-HASL? These are class 3 type bds.
Thanks in advance for your help.
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