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August 2004

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Subject:
From:
Roger Mouton <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 25 Aug 2004 15:07:09 +0000
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text/plain
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Mustafa,

I'm not sure I understand your question.  Are you asking what is the minimum acceptable variation of surface plating thickness?  Your post refers to specific thickness values.  Are you asking what to do to achieve those values?  Can you be more specific about the surface thickness variations you presently have and also give some feedback on your measurement of thickness in the holes?

I hope you will get more responses to your TechNet questions.

Regards,
Roger Mouton

-------------- Original message from Baski Devre : --------------

> Dear Technetters,
>
> The cupper plating should be between 20µ-18µ on PTH for Class 1 and Class
> 2s.
>
> But practically, Up to Which values (µm) can be minimize variation of
> surface plating thickness for Double Side-Panel plating-PTH processes?
>
> Thanks...
>
> Mustafa YÜCEL
> Product Quality Engineer
>
>
> BASKI DEVRE SAN. ve TIC. LTD. STI.
> Ceyhan Sk. No:10 81490 Pendik-Istanbul-Turkey
> Tel:00 90 216 3901036 (4 Line) /...4836560 (4 Line)
> Fax:00 90 216 3544941 /...4913269
> Internet: www.baskidevre.com.tr
>
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