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August 2004

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Subject:
Re: Low solder rework
From:
Tom Gervascio <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tom Gervascio <[log in to unmask]>
Date:
Wed, 25 Aug 2004 08:21:31 -0400
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The question would be why are they being reworked? Is it solderability or solder thickness related?
 
Re-HASL might grow a thicker layer of copper tin intermetallic. I would think removing the solder chemically, re cleaning and HASL would be desirable.

My two cents worth

>>> [log in to unmask] 08/24/04 06:14PM >>>
Is there a rework spec or standard for bare PCB's with low solder? Would it
be acceptable to simply re-HASL (hot-air-solder-level)them? Any reliablility
issues with re-HASL? These are class 3 type bds.
Thanks in advance for your help.

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