Mustafa,

Jeffrey mentioned the one primary factor in plating thickness control - A.S.F.  Eddie also touches on it in his response but not directly.  The other factors mentioned are really minor influences on thickness control.  The problem with A.S.F. is that it varies on the panel, especially if the panel has different circuit features, isolated traces, pads etc.

Please contact me off-net and I can direct you to some sources and technical papers that explain plating thickness control in greater detail and also provide solutions to this universally inherent problem with electrodeposition.

Roger Mouton
[log in to unmask]

-------------- Original message from Baski Devre : --------------

> Dear Technetters,
> What are the most effective common factors of the thickness contol at the
> Double Side, Panel plating, PTH process?
>
> Thanks...
>
> Mustafa YÜCEL
> Ürün Kalite Mühendisi
> Product Quality Engineer
>
> BASKI DEVRE SAN. ve TIC. LTD. STI.
> Ceyhan Sk. No:10 81490 Pendik-Istanbul-Turkey
> Tel: 00 90 216 3901036 (4 Hat/Line)
> 00 90 216 4836560 (4 Hat/Line)
> Fax: 00 90 216 3544941
> 00 90 216 4913269
> Internet:www.baskidevre.com.tr
>
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