Factors which help control the cu plating thickness would include:
1. A balanced outerlayer image. Add thieving if neecessary, avoid isolated
features which can over-plate.
2. Proper racking of the panels when plating. Make sure that each individual
panel is clamped to the plating racks with good metal to metal contacts.
3. Be consistent when locating the panels in your plating tanks. Meaning the
location of cu anodes in respect to the actual panels should be
equa-distant.
4. good solutuion movement in the cu plating tanks.
These factors along with your typical process controls should help you.
thanks,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Baski Devre
Sent: Wednesday, August 18, 2004 10:15 PM
To: [log in to unmask]
Subject: [TN] thickness contol


Dear Technetters,
What are the most effective common factors  of the thickness  contol at the
Double Side, Panel plating, PTH process?

Thanks...

Mustafa YÜCEL
Ürün Kalite Mühendisi
Product Quality Engineer

BASKI DEVRE SAN. ve TIC. LTD. STI.
Ceyhan Sk. No:10 81490 Pendik-Istanbul-Turkey
Tel:    00 90 216 3901036 (4 Hat/Line)
      00 90 216 4836560 (4 Hat/Line)
Fax:    00 90 216 3544941
      00 90 216 4913269
Internet:www.baskidevre.com.tr

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