Either run two types of bar, or perform regular dragout of copper rich
dross, by running the pot cool for a period of time, and skimming the top
out. It's how we treat our HASL process.
Regards,
Colin McVean
Circuit Manufacture Ltd
Unit 9-12
Rowleys Green Lane
Longford
Coventry
CV6 6AG
Tel: 02476 666168
Fax: 02476 637089
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Dave Chapman
Sent: 19 August 2004 12:57
To: [log in to unmask]
Subject: Re: [TN] Allowable copper contamination for SAC 305?
We just returned from a seminar by Cookson which said 1% would be
contamination point. Additional solder bars without copper would need to be
added to bring the balance in line. I imagine now we would need to have SAC
bars and SA bars to keep balance, either way close monitoring of pot
composition seems to be inevitable.
Dave C.
-----Original Message-----
From: Richard Kraszewski [mailto:[log in to unmask]]
Sent: Wednesday, August 18, 2004 4:08 PM
To: [log in to unmask]
Subject: [TN] Allowable copper contamination for SAC 305?
If one was to use a SAC305 alloy in a wave or selective soldering
application, how much copper contamination do you think would be
allowable before the melting range would become unacceptable. From what
I can see from the phase diagram, it appear one might be OK until you
reached ~ 0.8-0.9% copper?
Your thoughts would be appreciated.
Rich K / KEDS
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