Karen,

The tape should not stick to the back of the die if properly picked into
waffle packs. Often moisture from humid conditions can create surface
tension causing the die to "stick". Things to try:
1. increase vacuum pick up through larger ID Tool and/or stronger vac pump.
2. place waffle pack in dry box with lid cocked over night.
3. low temp bake (50C)of waffle pack with lid cocked for an hour or so (I've
never had to do this but would love you to be the guinea pig).

Let me know how you make out.
Regards,
Bruce Misner

-----Original Message-----
From: Karen Walters [mailto:[log in to unmask]]
Sent: Wednesday, August 18, 2004 2:14 PM
To: [log in to unmask]
Subject: [TN] Picking Die


Has anyone ever experience die sticking to the waffle paks during die
attach.  Please let me know what your solution was to this problem.  We
believe it is Nitto tape residue that sticks to the back of the die when
the die are picked from the wafer ring to the waffle pak

Please let me know your experience with this.


(Embedded image moved to file: pic26500.pcx)

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