Careful.  There are requirements use thick soft plating Ni.  For example,
wirebondable Pd must use soft underlining metallurgy. 3-5 micro inch of
gold?  what type of gold? are they for wire bond or solder (look like flash
gold for solder to me)?  50 micro inch Ni is low to block copper if it is
used for wirebond.  I saw good plating guy (almost best in the field) doing
80 miro inches Ni, but not below that (must pass gel test or high temp test
for wire bond).  Remember, wire ball bonding is high temperature process at
150-250 C.  May be I am out of date.  Let me know if someone is doing 50
micro inches Ni for ball wirebonding.  Thanks.

-my 1.53 cents
                           jk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of R Sedlak
Sent: Tuesday, August 24, 2004 10:36 AM
To: [log in to unmask]
Subject: Re: [TN] Low Stress Plating Question


Carrie:
Not sure I qualify as a plating "expert"...
But, it would appear that somebody got a decimal point in the wrong place,
as 50 microinches is more typical for Nickel thickness...
Are you talking about Electroless Nickel, or electroplated?

Rudy Sedlak
RD Chemical Company

"Morse, Carrie" <[log in to unmask]> wrote:
For all you Plating Experts
We have a customer specifying 500 micro inches minimum of Low Stress
Nickel under 3-5 micro inches of Gold.

1. What is the purpose of the Ni? Is it to aid in bonding the gold?
2. Is 500 micro inches too much? What are board houses capable of
doing without damaging the board and....what would board houses like to
see for a minimum specification on a note?

Thanks,
Carrie

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