Bev,
Maybe this will breed a new career opportunity - Disjointing Engineer!
-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: Tuesday, August 24, 2004 4:55 PM
To: [log in to unmask]
Subject: [LF] INTERPRETATION OF EU DIRECTIVES, ETC.
Greeting,
I have been out of circulation for several months, with respect to this
venue. I am not sure what all I have missed and perhaps my question has
already been asked and answered. However, it is a little hard to search for
this sort of thing in the archives so here I go:
IF I understood correctly, I recently heard at a conference the EU TAC are
now saying that the EU will require concentrations of the materials in
question down to the level of lead material, lead finish, gold wire,
overmold, etc., etc., NOT at the finished product, printed circuit board
assembly or even the component level.
1) Is this a correct interpretation?
2) If it is true AND coupled with the DRAFT Guidance Document for WEEE and
ROHS which states: "Homogeneous material means a material that can not be
mechanically disjointed into different materials." and further "The term
"mechanically disjointed" means that the materials can be, in principle,
separated by mechanical actions such as for example: unscrewing, cutting,
crushing, grinding and abrasive processes.", then I pose the following:
I can understand, on the basis of the above, how we have to look at the
situation in terms of our products disassembled. I can even imagine all the
components sheared off of printed circuit boards and looking at the separate
pieces of plastic, the PCB and the individual components. I have a hard
time of conceiving of the above methods reliably deconstructing a component
to give separate pieces of gold bond wire, but even accepting that, HOW IN
THE WORLD WOULD ONE MECHANICALLY SEPARATE A PLATING MATERIAL FROM THE BULK
LEAD MATERIAL?!
regards,
Bev Christian, Manager,
Materials Interconnect Lab
Research in Motion
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