Hi Dave
This comment isnt quite right....
"One, additional comment is that I believe in one of Kay's documents
from
Tin Technology (Soldertec) Full Lead-Free at the Highest Level means 0.0
which included everything. This is in our future, so we at least need to
be
aware that even inside components where lead is allowed at high levels,
lead alternatives are being considered."
What it actually means is that 0.1% (or a different level if it is
changed in the future) will always be accepted in materials as an
impurity level BUT that Pb will not be intentionally used in any
applications. i.e. all Pb use areas curently exempt from RoHS will be
Pb-free in the final stage. For example, no Pb in high melting solder,
no Pb in glass etc.
Does that make sense?
Kay
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of MA/NY DDave
Sent: 20 August 2004 19:58
To: [log in to unmask]
Subject: Re: [LF] 0.1% question
Hi Munish, ThomasA (Guenter's friend), IPC-LF Listservers.
Sorry an Old message as I strive to catch-up
On Thu, 29 Jul 2004 16:18:10 Munish <[log in to unmask]> wrote:
> ----- Original Message -----
> From: Gupta, Munish
> To: (Leadfree Electronics Assembly Forum) ; Thomi
> Cc: Peter L
> Sent: Thursday, July 29, 2004 4:16 PM
> Subject: Re: [LF] 0.1% question
>
>
> 29 july 04
>
> Q1. What is the definition of "lead-free"? Is there an allowable
threshold limit?
>
> A1. This is not included in the WEEE or ROHS Directives. However, it
is
mentioned in the sister EOLV (End-of-life Vehicles) Directive which
defines
0.1wt% as the threshold for lead per homogeneous material if not
intentionally introduced (i.e. each material prior to soldering), and it
is
likely that the same threshold will be used for the ROHS Directive. This
should be decided by mid 2004.>
Use << 0.1% by weight as your guide, with the condition that you are not
knowingly adding any lead (Pb) by design or forgetfullness that falls
outside of the current directives with exclusions.
We have read On List about proposed legislation requiring this o.1%
percentage yet it seems like there is much debate on the particulars and
the exclusions and my guess is how one does the measurements. Please
remember they have to worry and think about many particulars including
certain components that might require a high lead content due to
soldering
heirarchy.
One, additional comment is that I believe in one of Kay's documents from
Tin Technology (Soldertec) Full Lead-Free at the Highest Level means 0.0
which included everything. This is in our future, so we at least need to
be
aware that even inside components where lead is allowed at high levels,
lead alternatives are being considered.
Tin's Kay can correct me if I misread, or misunderstood what I wrote in
the
above paragraph.
Yours in Engineering, Dave
Y i Engr, MA/NY DDave
Yours in Engineering, Dave
Y i Engr, MA/NY DDave
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