Hi Vince, and IPC LF Listservers,

I had difficulty in thinking how to reply to your question since so much
came to mind on both sides of your question. I even thought of directing
you to some TI reports by our listers Doug, Bernard, and Abbott.

My best answer (I think right now) is that since you already recognize that
elevated temperatures are needed by the BGA of your choice the entire new
process has become a Lead Free process. This means check the components for
MSL ratings, check the laminate, the underfills, on and on.

Now if you put this component on all by itself independently at later step
maybe you could think of some local effects.

Hope this is correct if one looks at the full electronic assembly, and if
incorrect others LF listservers will Olympic me into the dust.


Yours in Engineering, Dave
Y i Engr, MA/NY DDave

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