I understand that there a problems with soldering components with Pb terminations in a Pb-free process (Pb-free solder paste and elevated temperature etc...), but are there any issues we should be aware of when assembling Pb-free terminated components in a Sn/Pb process - specifically BGA components?
One caution I have heard is that the reflow temperature must be sufficient to melt the solder balls (which makes sense), but are there other issues and problems we need to account for?

Thanks,

Vince Banas
NovAtel Inc.

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