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August 2004

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Subject:
From:
Lee Parker <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Tue, 10 Aug 2004 08:50:24 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (242 lines)
Very severe charring of the laminate. Somewhat as use to occurred when
the reflow machines used a direct radiate heat source that often burned
the boards.

Best regards

Lee   

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Nitin Kothari
Sent: Tuesday, August 10, 2004 4:45 AM
To: [log in to unmask]
Subject: Re: [LF] Tg material

Dear Victor,
How  reliability is getting affected due to weight loss? Could you
please be
more specific about "Disaster"?

Thanks,
NK


-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Lee Parker
Sent: Tuesday, August 10, 2004 12:12 AM
To: [log in to unmask]
Subject: Re: [LF] Tg material


Victor

If you loss 5% of the laminate during assembly it will obviously be a
disaster. This can be prevented by selecting a material that has a Td
high enough to be compatible with your assembly environment.

Best regards

Lee

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, August 09, 2004 12:05 PM
To: [log in to unmask]; [log in to unmask]
Cc: [log in to unmask]
Subject: RE: [LF] Tg material

Lee,

   How will the Td 5% weight loss effect the integrity of the laminate.

Victor,

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Lee Parker
Sent: Monday, August 09, 2004 10:58 AM
To: [log in to unmask]
Subject: Re: [LF] Tg material


Pascal

Td is the temperature that will cause a 5% weight loss in the material

Best regards

Lee

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Pascal Guiheneuf
Sent: Monday, August 09, 2004 9:38 AM
To: [log in to unmask]
Subject: Re: [LF] Tg material

Joe,

Td for PCB is thermal decomposition temperature (generally >320°C). Is
anyone able to give a complete definition ? Merci,

Pascal



-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Lee, Joe
[CAR:CP12:EXCH]
Sent: lundi 9 août 2004 14:43
To: [log in to unmask]
Subject: Re: [LF] Tg material


Lee:
What is Td materials?

Joe

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Lee Parker
Sent: Saturday, August 07, 2004 11:31 AM
To: [log in to unmask]
Subject: Re: [LF] Tg material


John

Accounts are moving to both high Tg and Td materials to accommodate the
higher assembly temperatures.

Best regards

Lee

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of John Foster
Sent: Friday, August 06, 2004 8:15 PM
To: [log in to unmask]
Subject: [LF] Tg material

I am curious if people have been automatically moving to higher Tg
laminates to support lead free.

Any input would be appreciated

Thank You.

We are just starting down the lead free path and this forum has been a
great help.

Thanks again
John Foster

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