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August 2004

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Subject:
From:
Lee Parker <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 9 Aug 2004 11:58:12 -0400
Content-Type:
text/plain
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text/plain (147 lines)
Pascal 

Td is the temperature that will cause a 5% weight loss in the material

Best regards

Lee 

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Pascal Guiheneuf
Sent: Monday, August 09, 2004 9:38 AM
To: [log in to unmask]
Subject: Re: [LF] Tg material

Joe,

Td for PCB is thermal decomposition temperature (generally >320°C).
Is anyone able to give a complete definition ?
Merci,

Pascal 



-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Lee, Joe
[CAR:CP12:EXCH]
Sent: lundi 9 août 2004 14:43
To: [log in to unmask]
Subject: Re: [LF] Tg material


Lee:
What is Td materials?

Joe

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Lee Parker
Sent: Saturday, August 07, 2004 11:31 AM
To: [log in to unmask]
Subject: Re: [LF] Tg material


John

Accounts are moving to both high Tg and Td materials to accommodate the
higher assembly temperatures.

Best regards

Lee

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of John Foster
Sent: Friday, August 06, 2004 8:15 PM
To: [log in to unmask]
Subject: [LF] Tg material

I am curious if people have been automatically moving to higher Tg
laminates
to support lead free.

Any input would be appreciated

Thank You.

We are just starting down the lead free path and this forum has been a
great
help.

Thanks again
John Foster

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Please visit IPC web site
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ext.5315
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