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August 2004

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Subject:
From:
Pratap Singh <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 9 Aug 2004 09:47:01 -0500
Content-Type:
text/plain
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text/plain (87 lines)
Folks,
You can get the book "Failure Modes and Mechanisms in Electronic
Packages" from web site of Kluwer Academics at www.wkap.nl OR from
Amazon.com. It was published by Chapman & Hall in 1998 but the
publication was sold to Kluwer Academics.

Victor G. Hernandez wrote:

>Dave,
>
>   You make reference to Failures and Mechanism in Electronics Packages.
>I assume that this is a publication.   The question here is where to
>acquire such a publication.
>
>Victor,
>
>-----Original Message-----
>From: Leadfree [mailto:[log in to unmask]] On Behalf Of MA/NY DDave
>Sent: Sunday, August 08, 2004 4:42 PM
>To: [log in to unmask]
>Subject: Re: [LF] AMKOR SnBi
>
>
>Hi Pratap, and IPC LF Listservers,
>
><My one concern is using SnBi finish - if that finish got soldered to a
>SnPb solder PCB by mistake, the resulting joints will fail due to a low
>melting point  ( 96 deg. C) SnPbBi phase. See section 6.6.3 and  Figures
>6.60 and 6.61 in "Failure Modes and Mechanisms in Electronics Packages",
>Chapman & Hall , 1998.
>
>There is a brief summary of Tin Whisker phenomenon also in the same book
>in section 6.7.7. The authors talk about Whisker Growth Mechanism and
>some prevention methods. That may be of interest to lead free forum
>members. Other metal platings that exhibit whisker formation include
>Zinc, Cadmium, Antimony and Indium.>>
>
>
>Pratap, let us say we had a low temperature or low current, low power
>application that would not raise the joint temperature to 96C. Would
>that be OK?
>
>Yours in Engineering, Dave
>Y i Engr, MA/NY DDave
>
>P.S. Yes Yes I will borrow the book. To see if purchase is reasonable to
>my long term needs.
>
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>
>

--
_____________________
pratap singh
Tel./Fax: (512) 255-6820
email: [log in to unmask]
www.rampinc.com

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