Folks,
You can get the book "Failure Modes and Mechanisms in Electronic
Packages" from web site of Kluwer Academics at www.wkap.nl OR from
Amazon.com. It was published by Chapman & Hall in 1998 but the
publication was sold to Kluwer Academics.
Victor G. Hernandez wrote:
>Dave,
>
> You make reference to Failures and Mechanism in Electronics Packages.
>I assume that this is a publication. The question here is where to
>acquire such a publication.
>
>Victor,
>
>-----Original Message-----
>From: Leadfree [mailto:[log in to unmask]] On Behalf Of MA/NY DDave
>Sent: Sunday, August 08, 2004 4:42 PM
>To: [log in to unmask]
>Subject: Re: [LF] AMKOR SnBi
>
>
>Hi Pratap, and IPC LF Listservers,
>
><My one concern is using SnBi finish - if that finish got soldered to a
>SnPb solder PCB by mistake, the resulting joints will fail due to a low
>melting point ( 96 deg. C) SnPbBi phase. See section 6.6.3 and Figures
>6.60 and 6.61 in "Failure Modes and Mechanisms in Electronics Packages",
>Chapman & Hall , 1998.
>
>There is a brief summary of Tin Whisker phenomenon also in the same book
>in section 6.7.7. The authors talk about Whisker Growth Mechanism and
>some prevention methods. That may be of interest to lead free forum
>members. Other metal platings that exhibit whisker formation include
>Zinc, Cadmium, Antimony and Indium.>>
>
>
>Pratap, let us say we had a low temperature or low current, low power
>application that would not raise the joint temperature to 96C. Would
>that be OK?
>
>Yours in Engineering, Dave
>Y i Engr, MA/NY DDave
>
>P.S. Yes Yes I will borrow the book. To see if purchase is reasonable to
>my long term needs.
>
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--
_____________________
pratap singh
Tel./Fax: (512) 255-6820
email: [log in to unmask]
www.rampinc.com
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