Haim,

There are still no accelerated testmethods for leadfree on which the
industry agrees.
So we all like to know how the chip suppliers can state that reliability
won't be compromised?



Jowan Iven



-----Original Message-----
From:   Leadfree [mailto:[log in to unmask]] On Behalf Of mech_eng
Sent:   donderdag 5 augustus 2004 14:53
To:     [log in to unmask]
Subject:        [LF] backwards compatibility of Sn/Bi plated components with Sn/Pb
solder paste

Hi,

I have gotten conflicting information on the backwards compatibility of
using Sn/Bi plated components with Sn/Pb solder paste.

As I understood the situation, under no circumstances could Bismuth be
mixed with Pb.

However, chip suppliers are stating that if the bismuth is maintained to
below 4% of the plating, the reliability of the solder joint is not
compromised.

Can someone shine some light on this specific backwards compatibility
issue.

Thanks,
Haim Halpert

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