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August 2004

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Subject:
Re: backwards compatibility of Sn/Bi plated components with Sn/Pb solder paste
From:
Danielle Casha <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Thu, 5 Aug 2004 08:09:57 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (60 lines) 
Its not so much a question of reliability, as it is melting temp.
When Bismuth is added to Lead, an alloy forms with a melting temp of less
than 100 deg C.
This can cause many issues, especially when trying to double side reflow!

Regards,
Danielle

Danielle L. Casha
Process Technician
EPM
905-479-6203 ext 272


-----Original Message-----
From:   mech_eng [SMTP:[log in to unmask]]
Sent:   Thursday, August 05, 2004 8:53 AM
To:     [log in to unmask]
Subject:        [LF] backwards compatibility of Sn/Bi plated components with Sn/Pb
solder paste

Hi,

I have gotten conflicting information on the backwards compatibility of
using Sn/Bi plated components with Sn/Pb solder paste.

As I understood the situation, under no circumstances could Bismuth be
mixed with Pb.

However, chip suppliers are stating that if the bismuth is maintained to
below 4% of the plating, the reliability of the solder joint is not
compromised.

Can someone shine some light on this specific backwards compatibility
issue.

Thanks,
Haim Halpert

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