Hi,
 
I have gotten conflicting information on the backwards compatibility of
using Sn/Bi plated components with Sn/Pb solder paste.
 
As I understood the situation, under no circumstances could Bismuth be
mixed with Pb.
 
However, chip suppliers are stating that if the bismuth is maintained to
below 4% of the plating, the reliability of the solder joint is not
compromised.
 
Can someone shine some light on this specific backwards compatibility
issue. 
 
Thanks,
Haim Halpert

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