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August 2004

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(Leadfree Electronics Assembly Forum)
Date:
Wed, 4 Aug 2004 10:48:58 EDT
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Jowan,

The key point here is that the amount of Ni in SN100C (<0.1%) is
insignificant compared with other nickel that is typically present in an electronic
assembly and in and around soldered joints.

There are nickel plating underlays to solderable coatings such as the popular
nickel/gold finish.  And the high nickel iron alloy "Alloy 42" is widely used
for component leadframes.

The nickel in the Nihon Superior SN100C is virtually all incorporated into
the crystal structure of the Cu6Sn5 intermetallic so that it would probably
behave differently than it would if it were present in a simple metallic form
although at the moment there is no data on that point.


Keith Sweatman
Nihon Superior Co., Ltd.


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