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August 2004

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Subject:
Re: Flex and LF
From:
to Paul Taylor <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 4 Aug 2004 11:41:02 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines) 
I posed a question some while ago, one of the main responses was around
delamination at high temperature due to moisture, maybe someone with more
up to date lead-free/flex information can share some findings

regards

Paul


Paul R Taylor

Senior Engineer, Product Supply Group
Pitney Bowes Ltd
email: [log in to unmask]

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