Is anyone aware of any reliability studies performed on high melt
temperature high lead content solders (85-90%Pb) in conjunction with
tin-silver-copper coatings or PCB finishes? I suspect that the tin rich
coating will decrease the solidus and liquidus temps of the resulting solder
volume, but I don't know the reliability effect of that reduction or if
there are confounding issues with silver or copper contamination.
Cheers,
Bob Hilty
Tyco Electronics
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