LEADFREE Archives

August 2004

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Subject:
From:
"Hilty, Robert D" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 26 Aug 2004 07:43:13 -0400
Content-Type:
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Is anyone aware of any reliability studies performed on high melt
temperature high lead content solders (85-90%Pb) in conjunction with
tin-silver-copper coatings or PCB finishes?  I suspect that the tin rich
coating will decrease the solidus and liquidus temps of the resulting solder
volume, but I don't know the reliability effect of that reduction or if
there are confounding issues with silver or copper contamination.

Cheers,

Bob Hilty
Tyco Electronics

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