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Subject:	Re: Antw: Re: [LF] INTERPRETATION OF EU DIRECTIVES, ETC.
From:	MA/NY DDave <[log in to unmask]>
Reply To:	(Leadfree Electronics Assembly Forum)
Date:	Thu, 26 Aug 2004 02:13:26 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (41 lines)

Hi IPC LF Listservers, Gaby, Bev and Guenter,

Wow this note tread moved on over to simple science to solve a .1% by
weight bulk property with a cotton swab and a dab of whatever like WD40, or
maybe a Lowenbrau. WOW!!! I guess science is a challenge for most people.
How about spit as an indicator after one eats let's say garlic, onions, or -
--.

Sorry for being not nice, SO back I go to Bev's original question.

Bev and Others, back awhile ago when I read On List about this procedure of
I can cut, I can grind, and I can do all these other things to get to the
true homogeneous material I thought this was totally SCREWY, and BLOODY.
Something had to be wrong with the normal English translation of the
process that was listed and the way my brain translated this process. The
word "Grinding" told me something was amiss in the translation.

On top of this I remembered another tread that Tin's Kay started awhile
before about "Homogeneous Material" where she asked us our interpretation.

My guess was that homogeneous material means what we think it should mean
yet at the single element level that when put together creates the entire
assembly. A lead with all it's metallurgy, the solder, the printed circuit
board without components, etc

As I believe Guenther pointed out this is a time consuming analysis, and
time is better spent making sure that BY-DESIGN all the suppliers have
removed Lead from from each element.

Yours in Engineering, Dave
Y i Engr, MA/NY DDave

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