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Date: | Wed, 11 Aug 2004 16:46:35 -0400 |
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Hi Dave,
A couple of comments a) shouldn't your gold be soft for wire bonding?.b) if
you have the boards plasma washed in 80 % argon and 20% oxygen you will get
rid of any organic compounds. Regards Steve Kelly
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Wednesday, August 11, 2004 4:01 PM
To: [log in to unmask]
Subject: [TN] Hard Gold Plating/Contaminate Question
Hi TechNet! Hey, looking for some help (Rudy, Frank, Gerard, plating folks).
Background: I have a test board which with approximately 80 uinches of
wirebondable hard gold plating that is having gold wirebond process
problems. An XPS (xray photoelectron spectroscopy) analysis of a "good"
versus "bad" test board revealed that the "bad" has significant organic
surface contamination for carbon and oxygen in the form of a hydrocarbon
(lots of C-C and C-H bonds). Now the question: can/will a hydrocarbon
species be codeposited into the gold plating thickness? I understand the
surface process/issues but the codeposit question came up.
Dave Hillman
Rockwell Collins
[log in to unmask]
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