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Date: | Mon, 9 Aug 2004 07:08:04 -0400 |
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I have been asked recently about the presence of elongated BGAs after card
assembly of a module to a PCB.
I am struggling with what reliability impact, if any, that they represent.
In addition I am looking for a list of reasons the condition can occur.
The ones that I can think of are:
- excessive warping in module when exposed to reflow temperature
- excessive moisture in module due to improper storage
- incorrect reflow parameters
Are there others?
Thanks.
Stephen Ayotte, IMD Manufacturing Quality Senior Engineer
Dept. N62V, Bldg. 966-2, Office 2J1309, Mail Drop 967A
Phone (802) 769-4775, t/l 446-4775, Fax (802) 769-4139
Pager (802) 878-5386 Pin #4685 - external, 74685 - internal
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