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Date: | Mon, 23 Aug 2004 07:46:17 -0400 |
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Sorry, sorry, sorry! Before I get slammed for replying to the forumn for an off-line request ...
Meant to drop the forum from the addressee slot, but the finger beat the brain to the keyboard. Still fairly early on Monday here. There must be some excuse for my unconscionable action ... but I don't know what it might be.
Anyway - Does anyone else have any new GOOD things to say about thermosonic gold ball bonding to immersion silvers?
Steve Creswick - Gentex Corporation
-----Original Message-----
From: Dennis Fritz [mailto:[log in to unmask]]
Sent: Friday, August 20, 2004 11:00 PM
To: [log in to unmask]
Subject: Re: [TN] Fwd: [TN] silver migration in membrane switches
There was a report from the IPC 3-11g committee at 2004 IPC Apex show about
the performance of silver board finish when used in a membrane switch
application. Please contact me off line if you cannot get a copy from the IPC
Committee home page for 3-11g.
Denny Fritz
MacDermid, Inc.
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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
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To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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