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Date: | Wed, 18 Aug 2004 10:11:23 -0700 |
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Hello,
We just successfully built x number of double sided, rigid-flex polyimide
boards and bake for 4 hrs at 125 C just prior to reflow. Limited floor life
between bake out / reflows to 2 hours, which basically required another bake
out prior to 2nd side reflow.
joe
-----Original Message-----
From: Mike McMonagle [mailto:[log in to unmask]]
Sent: Wednesday, August 18, 2004 9:25 AM
To: [log in to unmask]
Subject: [TN] Polyimide Boards, Aqueous Wash & Baking
I'd like some feedback from folks doing hi-rel assembly with polyimide
fabs. If you perform aqueous wash after during or after soldering
operations, do you perform a post-wash bakeout of the assembly prior to
additional soldering operations? If so, for how long and at what
temperature? I'm trying to correlate a customer specification to good
industry practices, TIA for the inputs....
Mike
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