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August 2004

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From:
Dave Chapman <[log in to unmask]>
Date:
Thu, 19 Aug 2004 06:57:18 -0500
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TechNet E-Mail Forum <[log in to unmask]>, Richard Kraszewski <[log in to unmask]>
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TechNet E-Mail Forum <[log in to unmask]>, Dave Chapman <[log in to unmask]>
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We just returned from a seminar by Cookson which said 1% would be
contamination point. Additional solder bars without copper would need to be
added to bring the balance in line. I imagine now we would need to have SAC
bars and SA bars to keep balance,  either way close monitoring of pot
composition seems to be inevitable.
Dave C.

-----Original Message-----
From: Richard Kraszewski [mailto:[log in to unmask]]
Sent: Wednesday, August 18, 2004 4:08 PM
To: [log in to unmask]
Subject: [TN] Allowable copper contamination for SAC 305?


If one was to use a SAC305 alloy in a wave or selective soldering
application, how much copper contamination do you think would be
allowable before the melting range would become unacceptable. From what
I can see from the phase diagram, it appear one might be OK until you
reached ~ 0.8-0.9% copper?

Your thoughts would be appreciated.

Rich K / KEDS

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