'netters,

Does anyone experience problems with the creation of a fillet using these
components. From time-to-time we see situations when the component floats
(lifts due in part to its light weight) resulting in most of the solder
nestling underneath, and having wetted the whole pad - a minimal fillet is
formed. The pad also seems to be unnecessarily long which tends to
exacerbate the problem.

TIA
Grant


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