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July 2004

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Subject:
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 12 Jul 2004 09:28:03 +0200
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Steve

If it is gas escaping too fast how about minimizing the gas is the
solder joints? Did you ever look at the metallization of the holes in
the boards?
The amount of gas in a THT solder joint corresponds to the amount of
glass fibres that are not metallized in the pre-plating process. And the
amount of non metallized glass fibres has to do with the quality of the
drilled holes (dull drill,  feed rate too high).

Best regards

Guenter


EMPA
Swiss Federal Laboratories  for Materials Testing and Research
Centre for Reliability
Guenter Grossmann,  Senior Engineer

8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :     xx41 1 823 4054
mail:     [log in to unmask]

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