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July 2004

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 9 Jul 2004 11:41:53 +0300
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It is EXTREMELY unlikely you will find anything that will dissolve the
cured underfill without destroying the whole assembly. That having been
said, I must add that it is not very clever asking this question without
telling us at least what the underfill, substrate and component
materials are. :-(

Brian

Karnwal, Pankaj wrote:
> Dear Technetters
>
> Can anybody tell me the name of the any solvent to clean the underfill  in
> the COP ( Chip on Board ).
>
> BR
> Pankaj Karnwal
> mailto:[log in to unmask]
>
>
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