Welcome to Summer and solder ball season. We did a range of fixes for Mid
Chip Balls. We have picked manually, washed in ultrasonic cleaner, aqueous
washer and also followed the " a process indicator is just that" rule. Work
on it to try and get it better and definitely make sure it gets no worse.
Our best solution was to work on our stencil aperture designs. We have not
scrapped any assemblies and we build to Class 2. Oh yeah "Hurry up October"
was our slogan, couldn't wait for the heat and humidity to go away because
so did most of our mid chip solder balls.
Dave Chapman
CSI



-----Original Message-----
From: Mary Jane Chism [mailto:[log in to unmask]]
Sent: Thursday, July 01, 2004 9:49 AM
To: [log in to unmask]
Subject: [TN] Solder Balls


Group,

I have a question on the "age old" subject matter of (flux encapsulated)
solder balls.  It has always been our belief if we can safely remove a
solder ball, we will; even if it fits the criteria of IPC-A-610 as being
a "process indicator".  Curiosity has gotten the best of us and we would
like to pose a question to the TechNet Forum.

What are some of the decisions other companies are making concerning the
practice of either keeping the (encapsulated) solder ball on the
assembly or removing with a dental pick or even an solder iron?  Also,
does anyone manufacture an assembly by where if there is a defective
solder ball (meets the Defect Class 1,2,3 criteria) on the assembly, you
scrap the entire assembly rather than remove the solder ball?

Please advise.  Thanks much


Mary Jane Chism
Kimball Electronics/Manufacturing Trainer


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Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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