Design and Process Implementation for Embedded Passives Components Technology
August 11-12, 2004 at IPC's Headquarters in Northbrook, IL


Instructors: Dennis Fritz, MacDermid, Inc.; John (Jack) Fisher, Interconnect Technology Analysis, Inc.; Richard Snogren, Coretec Denver, Inc; .Dieter Bergman IPC; 

With the explosive growth of wireless technology and high speed/frequency circuits, implementing embedded passives component technology has become vital to electronics manufacturing. 

Saving assembly real estate is no longer just an important benefit since performance often requires that resistor and capacitor devices be close to the power I/Os of the semiconductor.  Embedded passive technology fulfills this requirement.

This two day workshop will cover the how and why of conditions in the materials and assembly processes that impact product performance. The difference between integrated and embedded passive components will be explained. 

This course will provide understanding and know-how for those involved in design and manufacturing process implementation. Risk assessment and trade-offs of embedded passive technology and its integral involvement in the interconnect substrate will be also covered.


Price: $495 IPC/Designers Council Member                        $695 Non-member


To download the registration form and more information go to http://www.ipc.org/calendar/DesignforEP_804/DesignforEP_81104.htm, or contact Christi Poulsen at [log in to unmask] or via phone at 847-790-5327.

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