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July 2004

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 6 Jul 2004 09:59:37 -0400
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I would use IPC-6012 as a reference - the finishes and abb. are
specified there.  Tin, Silver and OSP do not have a min/max thickness,
while ENIG and electrolytic finishes should have a thickness specified.
ENIG - EN is generally 100 uinch min and IG is 2-10 uinches.



Jeffrey Bush
Director, Quality Assurance and Technical Support

                          76 Technology Drive - POB 1890
                             Brattleboro, Vermont 05302-1890
                                Tel. 802.257.4571.21 Fax. 802.257.0011
                                    [log in to unmask]
                              http://www.vtcircuits.com	



-----Original Message-----
From: Kane, Joseph E [mailto:[log in to unmask]] 
Sent: Thursday, July 01, 2004 5:04 PM
To: [log in to unmask]
Subject: [TN] Specifying PWB Finishes


We're preparing to order some test boards with alternative finishes for
lead-free testing, including immersion tin and OSP over bare copper.
Can anyone suggest how we might specify these board finishes in a
drawing note?  Our existing drawings pretty much specify only the
material and the thickness, something like "immersion gold, xxx thick,
over electroless nickel, xxx thick."

Joe Kane
BAE SYSTEMS Controls
Johnson City, NY

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