If the foot of the lead is not parallel to the pad it is toe down. The solder
requirement would be one lead thickness, On toe down this does not usually
come up to the heel bend radius.I have trouble with this every time.
Inspectors want to see the fillet above the midpoint of the heel, but with
toe down it is not always possible or practical.

-----Original Message-----
From: Daan Terstegge [mailto:[log in to unmask]]
Sent: Thursday, July 29, 2004 12:12 PM
To: [log in to unmask]
Subject: [TN] Toe-down configuration for gull wing leads


Hi Technet,

The IPC-A-610 (and related specs) mentions special requierments for solder
joint heel fillets when the leads have a "toe down configuration". I was
wondering if a definition exists of what exactly a toe down configuration
is. If the last portion of the tip of the lead is not 100% parallel with the
solderpad but has a small angle, does that mean it's a toe down
configuration ?
You help is appreciated as always,

Daan Terstegge
http://www.smtinfo.net

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