Hi Technet,

The IPC-A-610 (and related specs) mentions special requierments for solder
joint heel fillets when the leads have a "toe down configuration". I was
wondering if a definition exists of what exactly a toe down configuration
is. If the last portion of the tip of the lead is not 100% parallel with the
solderpad but has a small angle, does that mean it's a toe down
configuration ?
You help is appreciated as always,

Daan Terstegge
http://www.smtinfo.net

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