Beginning with 1/2 oz., and plating "up to" 1 oz. will only provide 1/2 oz.
of plating in the holes...depending upon your definition of 1/2 oz. there
could be as little as .6 mils of copper...not a whole lot...

What is typically done is starting at 1/2 oz. (or 1, or 2, etc etc) and
plating an additional 1 oz. on top of that...

As for "looking at companies with issues"...a company may desire to start at
1/2 oz., 1 oz. etc etc for many reasons...most having to do with cost and
not quality...if you use 1 oz foil you need resist that will contain the 1
oz. 'and' the plated copper...if you start with 1/2 oz. foil you can use a
thinner resist as well as less etchant...thus saving money...

So when you are "looking closely" at fabricators desiring to use another
type material...keep that in mind as well...

Franklin

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------