Hello,

I'm wondering if anyone could give me their opinion on how much missmatch can be tolerated between the size of the land on the PCB for a BGA ball and the size of the land on the actual decice carrier?
I have a design using a 1mm pitch 1508 pin BGA. The lands on the device are 0.4mm, and ideally, I'd like to make the PCB land 0.4mm as well. 
I'm also looking at using a filled and overplated via-in-pad on these lands, and my board shop would like to be able to use 0.5mm lands with a 0.25mm hole. 
That doesn't seem like much, but equates to roughly 40% difference in land area. Am I worrying needlessly?

thanks in advance,

Phil Dutton C.I.D.

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