Ladies and gentlemen of Technet,

I have a potential customer wanting to reball (or rebump) an LTCC device.
The curious thing to me is that there are a grouping of gold lands in the
center of the part which require 4 spheres per land.  Even if I were to keep
a stencil with the part during reflow, I am concerned that my 4 spheres
would become one sphere or that the solder paste would do the same.

The spheres are 8 mil with an alloy of 10/90 (as would be the paste).  Since
these are high temp, would there be less spreading of the solder accross the
lands?  Could the spreading of the solder be controlled with temperature?

Does anyone have any experience handling or reballing these type components?
  Any advice would be greatly appreciated.


Thank you,


David Tremmel
Production Manager
Belmont Component Services
(847) 412-9690 - Phone
(847) 412-9693 - Fax
www.belmont-trading.com

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